Micron Technology, Inc.
Devices including conductive interconnect structures, related electronic systems, and related methods

Abstract:

A semiconductor device comprises conductive lines, a conductive landing pad in electrical communication with a conductive line of the conductive lines, and a conductive interconnect structure in electrical communication with the conductive landing pad. The conductive interconnect structure comprises a contact plug in electrical communication with the conductive landing pad, and a global interconnect contact in electrical communication with the contact plug and having a greater lateral width than the contact plug. Related electronic systems and method are also disclosed.