Micron Technology, Inc.
Memory device with low density thermal barrier

Last updated:

Abstract:

Methods, systems, and devices related to a memory device with a thermal barrier are described. The thermal barrier (e.g., a low density thermal barrier) may be positioned between an access line (e.g., a digit line or a word line) and a cell component. The thermal barrier may be formed on the surface of a barrier material by applying a plasma treatment to the barrier material. The thermal barrier may have a lower density than the barrier material and may be configured to thermally insulate the cell component from thermal energy generated in the memory device, among other benefits.

Status:
Grant
Type:

Utility

Filling date:

1 May 2019

Issue date:

26 Oct 2021