Micron Technology, Inc.
Parallel memory access and computation in memory devices

Abstract:

An integrated circuit (IC) memory device encapsulated within an IC package. The memory device includes first memory regions configured to store lists of operands; a second memory region configured to store a list of results generated from the lists of operands; and at least one third memory region. A communication interface of the memory device can receive requests from an external processing device; and an arithmetic compute element matrix can access memory regions of the memory device in parallel. When the arithmetic compute element matrix is processing the lists of operands in the first memory regions and generating the list of results in the second memory region, the external processing device can simultaneously access the third memory region through the communication interface to load data into the third memory region, or retrieve results that have been previously generated by the arithmetic compute element matrix.