Micron Technology, Inc.
Centralized placement of command and address in memory devices

Abstract:

Memory devices, memory systems, and systems, include memory devices with a bonding pad region including two or more bonding pads for operably coupling to external signals and a number of command-and-address (CA) input signals. The memory device also includes a centralized CA interface region including two or more CA input circuits operably coupled to the number of input signals. One of the two or more CA input circuits for each CA input signal may border at least two other CA input circuits coupled to different CA input signals.