Micron Technology, Inc.
Integrated transistors having gate material passing through a pillar of semiconductor material, and methods of forming integrated transistors

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Abstract:

Some embodiments include an integrated assembly having a pillar of semiconductor material. The pillar has a base region, and bifurcates into two segments which extend upwardly from the base region. The two segments are horizontally spaced from one another by an intervening region. A conductive gate is within the intervening region. A first source/drain region is within the base region, a second source/drain region is within the segments, and a channel region is within the segments. The channel region is adjacent to the conductive gate and is vertically disposed between the first and second source/drain regions. Some embodiments include methods of forming integrated assemblies.

Status:
Grant
Type:

Utility

Filling date:

30 Jul 2019

Issue date:

16 Nov 2021