Micron Technology, Inc.
Integrated transistors having gate material passing through a pillar of semiconductor material, and methods of forming integrated transistors
Last updated:
Abstract:
Some embodiments include an integrated assembly having a pillar of semiconductor material. The pillar has a base region, and bifurcates into two segments which extend upwardly from the base region. The two segments are horizontally spaced from one another by an intervening region. A conductive gate is within the intervening region. A first source/drain region is within the base region, a second source/drain region is within the segments, and a channel region is within the segments. The channel region is adjacent to the conductive gate and is vertically disposed between the first and second source/drain regions. Some embodiments include methods of forming integrated assemblies.
Status:
Grant
Type:
Utility
Filling date:
30 Jul 2019
Issue date:
16 Nov 2021