Micron Technology, Inc.
Routing for power signals including a redistribution layer
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Abstract:
Semiconductor devices and systems are disclosed. A semiconductor device includes a redistribution layer including a first polygonal structure for conveying a first power signal and including a first cutout region. The semiconductor device further includes a second polygonal structure for conveying a second power signal. Further, the semiconductor device includes an island polygon for conveying a third power signal and positioned within the first cutout region, wherein the island polygon does not touch the first polygonal structure.
Status:
Grant
Type:
Utility
Filling date:
23 Jun 2020
Issue date:
16 Nov 2021