Micron Technology, Inc.
Integrated Assemblies and Methods of Forming Integrated Assemblies

Abstract:

Some embodiments include an integrated assembly having a first structure containing semiconductor material, and having a second structure contacting the first structure. The first structure has a composition along an interface with the second structure. The composition includes additive to a concentration within a range of from about 10.sup.18 atoms/cm.sup.3 to about 10.sup.21 atoms/cm.sup.3. The additive includes one or more of carbon, oxygen, nitrogen and sulfur. Some embodiments include methods of forming integrated assemblies.