Micron Technology, Inc.
TRANSMITTING DATA SIGNALS ON SEPARATE LAYERS OF A MEMORY MODULE, AND RELATED METHODS AND APPARATUSES
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Abstract:
Apparatuses and methods for routing and transmitting signals in an electronic device are described. Various signal paths may be routed to avoid or limit reference transitions or transitions between layers of a structure of a device (e.g., printed circuit board (PCB)). In a memory module, for example, different data inputs/outputs (e.g., DQs) may be routed through different layers of a PCB according to their relative location to one another. For instance, DQs associated with even bits of a byte may be routed on one layer of a PCB near one ground plane, and DQs associated with odd bits of the byte may be routed on a different layer of the PCB near another ground plane.
Status:
Application
Type:
Utility
Filling date:
27 Jul 2021
Issue date:
18 Nov 2021