Micron Technology, Inc.
LIDDED MICROELECTRONIC DEVICE PACKAGES AND RELATED SYSTEMS, APPARATUS, AND METHODS OF MANUFACTURE

Abstract:

A microelectronic device package may include one or more semiconductor dice coupled to a substrate. The microelectronic device package may further include a lid coupled to the substrate, the lid defining a volume over and around the one or more semiconductor die. The microelectronic device package may further include a thermally conductive dielectric filler material substantially filling the volume defined around the semiconductor die.