Micron Technology, Inc.
MICROELECTRONIC DEVICE PACKAGES WITH EMI SHIELDING, METHODS OF FABRICATING AND RELATED ELECTRONIC SYSTEMS

Abstract:

This patent application relates to microelectronic device packages with internal EMI shielding, methods of fabricating and related electronic systems. One or more microelectronic devices of a package including multiple microelectronic devices are EMI shielded, and one or more other microelectronic devices of the package are located outside the EMI shielding.