Micron Technology, Inc.
METHODS AND APPARATUS FOR TEMPERATURE MODIFICATION AND REDUCTION OF CONTAMINATION IN BONDING STACKED MICROELECTRONIC DEVICES

Abstract:

This patent application relates to methods and apparatus for temperature modification and reduction of contamination in bonding stacked microelectronic devices with heat applied from a bond head of a thermocompression bonding tool. The stack is substantially enclosed within a skirt carried by the bond head to reduce heat loss and contaminants from the stack, and heat may be added from the skirt.