Micron Technology, Inc.
Systems and methods for data path power savings in DDR5 memory devices

Last updated:

Abstract:

A memory device includes a data path having a data bus. The memory device further includes a first one-hot communications interface communicatively coupled to the data bus, and a second one-hot communications interface communicatively coupled to the data bus. The memory device additionally includes at least one memory bank, and an input/output (I/O) interface communicatively coupled to the at least one memory bank via the first one-hot communications interface and the second one-hot communications interface, wherein the first one-hot communications interface is configured to convert a first data pattern received by the I/O interface into one-hot signals transmitted via the data bus to the second one-hot communications interface, and wherein the second one-hot communications interface is configured to convert the one-hot signals into the first data pattern to be stored in the at least one memory bank.

Status:
Grant
Type:

Utility

Filling date:

30 Dec 2019

Issue date:

28 Dec 2021