Micron Technology, Inc.
Integrated assemblies comprising sense-amplifier-circuitry and wordline-driver-circuitry under memory cells of a memory array

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Abstract:

Some embodiments include an integrated assembly having a base comprising sense-amplifier-circuitry, a first deck over the base, and a second deck over the first deck. The first deck includes a first portion of a first array of first memory cells, and includes a first portion of a second array of second memory cells. The second deck includes a second portion of the first array of the first memory cells, and includes a second portion of the second array of the second memory cells. A first digit line is associated with the first array, and a second digit line is associated with the second array. The first and second digit lines are comparatively coupled with one another through the sense-amplifier-circuitry.

Status:
Grant
Type:

Utility

Filling date:

17 Dec 2020

Issue date:

18 Jan 2022