Micron Technology, Inc.
Sacrificial separators for wafer level encapsulating

Abstract:

A method may include forming a set of walls on a surface of a substrate, the set of walls dividing the substrate into multiple sections, each of the multiple sections having at least one respective semiconductor device. The method may further include depositing a molding compound onto the substrate, the molding compound at least partially filling a space defined by the set of walls over each of the multiple sections and covering the respective semiconductor device of each of the multiple sections.