Micron Technology, Inc.
ABNORMAL CONDITION DETECTION BASED ON TEMPERATURE MONITORING OF MEMORY DIES OF A MEMORY SUB-SYSTEM

Abstract:

A set of temperature measurements corresponding to a set of memory dies of a memory sub-system is collected. The set of temperature measurements includes a temperature measurement determined for each memory die of the set of memory dies. A determination is made whether a first temperature measurement of the set of temperature measurements satisfies a first condition. It is determined whether a temperature variation of the set of temperature measurements satisfies a second condition. In response to a determination that the first temperature measurement satisfies the first condition or the temperature variation satisfies the second condition, a temperature related event is logged. A message is sent to a host system indicating the temperature related event.