Micron Technology, Inc.
REDUCED RESISTIVITY FOR ACCESS LINES IN A MEMORY ARRAY

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Abstract:

Methods, systems, and devices for reduced resistivity for access lines in a memory array are described. A first metal layer may be formed above a via that is configured to couple an access line of a memory array with a corresponding driver. The first metal layer may be oxidized, and then a second metal layer may be formed above the oxidized first metal layer. One or more access lines of the memory device may be formed from the second metal layer, the oxidized first metal layer, or both.

Status:
Application
Type:

Utility

Filling date:

14 Aug 2020

Issue date:

17 Feb 2022