Micron Technology, Inc.
MEMORY DEVICES, CARRIERS FOR SAME, AND RELATED COMPUTING SYSTEMS AND METHODS

Abstract:

Memory devices may include a substrate supporting at least one semiconductor device thereon. The substrate may include an interface sized, shaped, and configured to provide electrical connection to the at least one semiconductor device, the interface located proximate to an end of the substrate. Engagement structures may be located proximate to, and laterally outward from, the interface. The engagement structures may extend laterally beyond a remainder of a lateral periphery of the substrate, each engagement structure comprising a first depth at a first portion of the engagement structure and a second, smaller depth at a second, laterally inward portion of the engagement structure. A carrier may include supports shaped, positioned, and configured to be positioned in the second portions of the engagement structures to secure the end of the substrate to the carrier.