Micron Technology, Inc.
Conductive Interconnects
Last updated:
Abstract:
Some embodiments include conductive interconnects which include the first and second conductive materials, and which extend upwardly from a conductive structure. Some embodiments include integrated assemblies having conductive interconnects.
Status:
Application
Type:
Utility
Filling date:
7 Aug 2020
Issue date:
10 Feb 2022