Micron Technology, Inc.
Conductive Interconnects

Last updated:

Abstract:

Some embodiments include conductive interconnects which include the first and second conductive materials, and which extend upwardly from a conductive structure. Some embodiments include integrated assemblies having conductive interconnects.

Status:
Application
Type:

Utility

Filling date:

7 Aug 2020

Issue date:

10 Feb 2022