Micron Technology, Inc.
TEST CIRCUIT FOR DETECTING PARASITIC CAPACITANCE OF TSV

Abstract:

Disclosed herein is an apparatus that includes a first semiconductor chip, and a first TSV penetrating the first semiconductor chip. The first semiconductor chip includes a first resistor coupled between a first power supply and a first node, a switch circuit coupled between the first node and the first TSV, a pad electrode operatively coupled to the first node, and a constant current source operatively coupled to either one of the first node and the pad electrode.