Micron Technology, Inc.
SURFACE MOUNT DEVICE BONDED TO AN INNER LAYER OF A MULTI-LAYER SUBSTRATE

Abstract:

An apparatus includes a primary layer of a substrate that includes an open area that extends through the primary layer to an inner layer of the substrate. The apparatus includes a secondary layer of the substrate. The apparatus also includes the inner layer of the substrate that is positioned between the primary layer and the secondary layer. The inner layer includes component bond pads that are disposed on the inner layer and that are exposed via the open area of the primary layer.