Micron Technology, Inc.
Methods of forming semiconductor structures comprising thin film transistors including oxide semiconductors

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Abstract:

A method of forming a semiconductor structure comprises forming an array of vertical thin film transistors. Forming the array of vertical thin film transistors comprises forming a source region, forming a channel material comprising an oxide semiconductor material over the source region, exposing the channel material to a dry etchant comprising hydrogen bromide to pattern the channel material into channel regions of adjacent vertical thin film transistor structures, forming a gate dielectric material on sidewalls of the channel regions, forming a gate electrode material adjacent to the gate dielectric material, and forming a drain region over the channel regions. Related methods of forming semiconductor structures and an array of memory cells are also disclosed.

Status:
Grant
Type:

Utility

Filling date:

30 Jun 2020

Issue date:

15 Mar 2022