Micron Technology, Inc.
Initialization sequencing of chiplet I/O channels within a chiplet system

Last updated:

Abstract:

A system comprises an interposer including interconnect and multiple chiplets arranged on the interposer. Each chiplet includes multiple chiplet input-output (I/O) channels interconnected to I/O channels of other chiplets by the interposer; a chiplet I/O interface for the chiplet I/O channels that includes multiple interface layers; and initialization logic circuitry configured to advance initialization of the chiplet interface sequentially through the interface layers starting with a lowest interface layer.

Status:
Grant
Type:

Utility

Filling date:

20 Oct 2020

Issue date:

5 Apr 2022