Micron Technology, Inc.
Methods and apparatus for protection of dielectric films during microelectronic component processing
Last updated:
Abstract:
Disclosed are methods and apparatus for protecting dielectric films on microelectronic components from contamination associated with singulation, picking and handling of singulated microelectronic components from a wafer for assembly with other components.
Status:
Grant
Type:
Utility
Filling date:
16 Dec 2019
Issue date:
29 Mar 2022