Micron Technology, Inc.
Methods and apparatus for protection of dielectric films during microelectronic component processing

Last updated:

Abstract:

Disclosed are methods and apparatus for protecting dielectric films on microelectronic components from contamination associated with singulation, picking and handling of singulated microelectronic components from a wafer for assembly with other components.

Status:
Grant
Type:

Utility

Filling date:

16 Dec 2019

Issue date:

29 Mar 2022