Micron Technology, Inc.
Ball grid array storage for a memory sub-system
Last updated:
Abstract:
An apparatus includes a memory component having a plurality of ball grid array (BGA) components, wherein each respective one of the BGA components includes a plurality of memory blocks and a BGA component controller and firmware adjacent the plurality of memory blocks to manage the plurality of memory blocks. The apparatus further includes a processing device, included in the memory component, to perform memory operations on the BGA components.
Status:
Grant
Type:
Utility
Filling date:
18 Dec 2020
Issue date:
12 Apr 2022