Micron Technology, Inc.
THREE-DIMENSIONAL FUSE ARCHITECTURES AND RELATED SYSTEMS, METHODS, AND APPARATUSES

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Abstract:

Apparatuses, methods, and computing systems relating to three-dimensional fuse architectures are disclosed. An apparatus includes a semiconductor substrate, a fuse array on or in the semiconductor substrate, and fuse circuitry on or in the semiconductor substrate. The fuse array includes fuse cells. The fuse circuitry is configured to access the fuse cells. The fuse circuitry is offset from the fuse array such that the fuse circuitry is disposed between the semiconductor substrate and the fuse array, or the fuse array is disposed between the semiconductor substrate and the fuse circuitry.

Status:
Application
Type:

Utility

Filling date:

5 Oct 2020

Issue date:

7 Apr 2022