Micron Technology, Inc.
ELECTRONIC DEVICES WITH RECESSED CONDUCTIVE STRUCTURES AND RELATED METHODS AND SYSTEMS

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Abstract:

An electronic device comprises a stack structure comprising vertically alternating insulative structures and conductive structures arranged in tiers, pillars extending vertically through the stack structure, and a barrier material overlying the stack structure. The electronic device comprises a first insulative material extending through the barrier material and into an upper tier portion of the stack structure, and a second insulative material laterally adjacent to the first insulative material and laterally adjacent to at least some of the conductive structures in the upper tier portion of the stack structure. At least a portion of the second insulative material is in vertical alignment with the barrier material. Additional electronic devices and related methods and systems are also disclosed.

Status:
Application
Type:

Utility

Filling date:

6 Oct 2020

Issue date:

7 Apr 2022