Micron Technology, Inc.
DYNAMIC POWER AND THERMAL LOADING IN A CHIPLET-BASED SYSTEM

Abstract:

A chiplet system comprises an interposer including interconnect and multiple chiplets arranged on the interposer and interconnected using the interconnect of the interposer. The multiple chiplets include a throttle level bus source chiplet including a throttle level bus drive interface configured to place a throttle level value onto the throttle level bus, and one or more throttle level bus receiver chiplets operatively coupled to the throttle level bus. Each chiplet of the multiple chiplets includes throttling logic circuitry configured to set a throttle level of a chiplet according to the throttle level value.