Micron Technology, Inc.
ESD PLACEMENT IN SEMICONDUCTOR DEVICE

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Abstract:

Disclosed herein is an apparatus that includes a first power ESD protection circuit arranged in a first circuit area; a plurality of data I/O circuits arranged in a second circuit area adjacent to the first circuit area in a first direction; a plurality of data I/O terminals arranged in the second circuit area, each of the plurality of data I/O terminals being coupled to an associated one of the plurality of data I/O circuits; a plurality of first power terminals arranged in the second circuit area; and a first power line extending in the first direction, the first power line coupling the plurality of first power terminals to the first power ESD protection circuit.

Status:
Application
Type:

Utility

Filling date:

15 Oct 2020

Issue date:

21 Apr 2022