Micron Technology, Inc.
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
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Abstract:
A semiconductor device includes a first layer including a plurality of wirings arranged in line and space layout and a second layer including a pad electrically connected to at least one of the wirings, wherein the wirings and the pads are patterned by different lithographic processes.
Status:
Application
Type:
Utility
Filling date:
19 Oct 2020
Issue date:
21 Apr 2022