Micron Technology, Inc.
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

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Abstract:

A semiconductor device includes a first layer including a plurality of wirings arranged in line and space layout and a second layer including a pad electrically connected to at least one of the wirings, wherein the wirings and the pads are patterned by different lithographic processes.

Status:
Application
Type:

Utility

Filling date:

19 Oct 2020

Issue date:

21 Apr 2022