Micron Technology, Inc.
Memory component for a system-on-chip device
Last updated:
Abstract:
The present disclosure relates to a memory component for a System-on-Chip (SoC) structure including at least a memory array and at least a logic portion for interacting with the memory array and with the SoC structure wherein the memory component is a structurally independent semiconductor device coupled to and partially overlapping the SoC structure.
Status:
Grant
Type:
Utility
Filling date:
31 May 2019
Issue date:
17 May 2022