Micron Technology, Inc.
Memory component for a system-on-chip device

Last updated:

Abstract:

The present disclosure relates to a memory component for a System-on-Chip (SoC) structure including at least a memory array and at least a logic portion for interacting with the memory array and with the SoC structure wherein the memory component is a structurally independent semiconductor device coupled to and partially overlapping the SoC structure.

Status:
Grant
Type:

Utility

Filling date:

31 May 2019

Issue date:

17 May 2022