Micron Technology, Inc.
Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
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Abstract:
A pad for chemical mechanical planarization comprises a material having a major surface, and asperities extending from the major surface, a ratio between a length and a width of each of the asperities greater than about 2:1, and an included angle between a leading surface of at least some asperities and the major surface greater than about 90.degree.. Related pads, tools for chemical mechanical planarization, and related methods are also disclosed.
Status:
Grant
Type:
Utility
Filling date:
1 Feb 2019
Issue date:
17 May 2022