Micron Technology, Inc.
Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods

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Abstract:

A pad for chemical mechanical planarization comprises a material having a major surface, and asperities extending from the major surface, a ratio between a length and a width of each of the asperities greater than about 2:1, and an included angle between a leading surface of at least some asperities and the major surface greater than about 90.degree.. Related pads, tools for chemical mechanical planarization, and related methods are also disclosed.

Status:
Grant
Type:

Utility

Filling date:

1 Feb 2019

Issue date:

17 May 2022