Micron Technology, Inc.
Temperature-based block family combinations in a memory device

Abstract:

An example memory sub-system includes a memory device and a processing device, operatively coupled to the memory device. The processing device is configured to identify a first temperature level of a first block family associated with a memory device; identify a second temperature level of a second block family associated with the memory device; determine if a condition is satisfied based on the first temperature level and the second temperature level; and in response to the condition being satisfied, combine the first block family and the second block family to generate a combined block family.