Micron Technology, Inc.
Methods for selectively removing more-doped-silicon-dioxide relative to less-doped-silicon-dioxide

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Abstract:

Some embodiments include a method in which an assembly is formed to have a first silicon-dioxide-containing-material and a second silicon-dioxide-containing-material. The first silicon-dioxide-containing-material has a higher concentration of dopant therein than does the second silicon-dioxide-containing-material. The first silicon-dioxide-containing-material is selectively removed relative to the second silicon-dioxide-containing-material using a mixture which includes hydrofluoric acid, a second acid and an organic solvent. The organic solvent may include at least one ester and/or at least one ether. The second acid may have a pKa of less than about 5.

Status:
Grant
Type:

Utility

Filling date:

18 Apr 2019

Issue date:

14 Jun 2022