Micron Technology, Inc.
METHODS FOR FORMING CONDUCTIVE ELEMENTS FOR MICROELECTRONIC COMPONENTS, RELATED CONDUCTIVE ELEMENTS, AND MICROELECTRONIC COMPONENTS, ASSEMBLIES AND ELECTRONIC SYSTEMS INCORPORATING SUCH CONDUCTIVE ELEMENTS

Abstract:

A microelectronic component comprises a substrate having at least one bond pad on a surface thereof and a metal pillar structure on the at least one bond pad, the metal pillar structure comprising a metal pillar on the at least one bond pad and a solder material having a portion within a reservoir within the metal pillar and another portion protruding from an end of the metal pillar opposite the at least one bond pad. Methods for forming the metal pillar structures, metal pillar structures, assemblies and systems incorporating the metal pillar structures are also disclosed.