Micron Technology, Inc.
Memory cells having resistors and formation of the same

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Abstract:

The present disclosure includes memory cells having resistors, and methods of forming the same. An example method includes forming a first conductive line, forming a second conductive line, and forming a memory element between the first conductive line and the second conductive line. Forming the memory element can include forming one or more memory materials, and forming a resistor in series with the one or more memory materials. The resistor can be configured to reduce a capacitive discharge through the memory element during a state transition of the memory element.

Status:
Grant
Type:

Utility

Filling date:

4 Jun 2020

Issue date:

28 Jun 2022