Micron Technology, Inc.
Memory tiering using PCIe connected far memory

Abstract:

A processing device in a host system monitors a data temperature of a plurality of memory pages stored in a host-addressable region of a cache memory component operatively coupled with the host system. The processing device determines that a first memory page of the plurality of memory pages satisfies a first threshold criterion pertaining to the data temperature of the first memory page and sends a first migration command indicating the first memory page to a direct memory access (DMA) engine executing on a memory-mapped storage component operatively coupled with the cache memory component and with the memory-mapped storage component via a peripheral component interconnect express (PCIe) bus. The first migration command causes the DMA engine to initiate a first DMA transfer of the first memory page from the cache memory component to a host-addressable region of the memory-mapped storage component.