Micron Technology, Inc.
MICROELECTRONIC DEVICES INCLUDING VOIDS NEIGHBORING CONDUCTIVE CONTACTS, AND RELATED MEMORY DEVICES, ELECTRONIC SYSTEMS, AND METHODS

Abstract:

A microelectronic device comprises a stack structure comprising a vertically alternating sequence of conductive structures and insulative structures arranged in tiers, strings of memory cells vertically extending through the stack structure, the strings of memory cells individually comprising a channel material vertically extending through the stack structure, a conductive contact structure vertically overlying and in electrical communication with the channel material of a string of memory cells of the strings of memory cells, and a void laterally neighboring the conductive contact structure, the conductive contact structure separated from a laterally neighboring conductive contact structure by the void, a dielectric material, and an additional void laterally neighboring the laterally neighboring conductive contact structure. Related memory devices, electronic systems, and methods are also described.