Micron Technology, Inc.
Methods for forming memory devices, and associated devices and systems

Abstract:

Methods of manufacturing memory devices, and associated systems and devices, are disclosed herein. In one embodiment, a method of manufacturing a memory device includes (a) removing a portion of an insulative material to define a recess, (b) forming a memory stack in the recess, and (c) etching the memory stack to define a plurality of memory elements. In some embodiments, the method can further include forming conductive vias in a remaining portion of the insulative material, and forming a metallization structure electrically coupling the conductive vias to corresponding ones of the memory elements.