Micron Technology, Inc.
Integrated assemblies having memory cells with capacitive units and reference-voltage-generators with resistive units

Last updated:

Abstract:

Embodiments include an integrated assembly having a deck over a base, and having memory cells supported by the deck. Each of the memory cells includes a capacitive unit and a transistor. The individual capacitive units of the memory cells each have a storage node electrode, a plate electrode, and a capacitor dielectric material between the storage node electrode and the plate electrode. A reference-voltage-generator includes resistive units supported by the deck. The resistive units are similar to the memory cells but include interconnecting units in place of the capacitive units. The interconnecting units of some adjacent resistive units are shorted to one another.

Status:
Grant
Type:

Utility

Filling date:

8 Jan 2021

Issue date:

26 Jul 2022