Micron Technology, Inc.
Method of forming photonics structures

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Abstract:

The disclosed embodiments relate to an integrated circuit structure and methods of forming them in which photonic devices are formed on the back end of fabricating a CMOS semiconductor structure containing electronic devices. Doped regions associated with the photonic devices are formed using microwave annealing for dopant activation.

Status:
Grant
Type:

Utility

Filling date:

10 Jul 2020

Issue date:

2 Aug 2022