Micron Technology, Inc.
Method of forming photonics structures
Last updated:
Abstract:
The disclosed embodiments relate to an integrated circuit structure and methods of forming them in which photonic devices are formed on the back end of fabricating a CMOS semiconductor structure containing electronic devices. Doped regions associated with the photonic devices are formed using microwave annealing for dopant activation.
Status:
Grant
Type:
Utility
Filling date:
10 Jul 2020
Issue date:
2 Aug 2022