Micron Technology, Inc.
MEMORY COMPONENT FOR A SYSTEM-ON-CHIP DEVICE
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Abstract:
The present disclosure relates to a memory component for a System-on-Chip (SoC) structure including at least a memory array and at least a logic portion for interacting with the memory array and with the SoC structure wherein the memory component is a structurally independent semiconductor device coupled to and partially overlapping the SoC structure.
Status:
Application
Type:
Utility
Filling date:
16 May 2022
Issue date:
1 Sep 2022