Micron Technology, Inc.
MEMORY COMPONENT FOR A SYSTEM-ON-CHIP DEVICE

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Abstract:

The present disclosure relates to a memory component for a System-on-Chip (SoC) structure including at least a memory array and at least a logic portion for interacting with the memory array and with the SoC structure wherein the memory component is a structurally independent semiconductor device coupled to and partially overlapping the SoC structure.

Status:
Application
Type:

Utility

Filling date:

16 May 2022

Issue date:

1 Sep 2022