Micron Technology, Inc.
Stacked interposer structures, microelectronic device assemblies including same, and methods of fabrication, and related electronic systems

Abstract:

An interposer comprises a semiconductor material and includes cache memory under a location on the interposer for a host device. Memory interface circuitry may also be located under one or more locations on the interposer for memory devices. Microelectronic device assemblies incorporating such an interposer and comprising a host device and multiple memory devices are also disclosed, as are methods of fabricating such microelectronic device assemblies.