Micron Technology, Inc.
Methods for fabricating 3D semiconductor device packages, resulting packages and systems incorporating such packages
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Abstract:
Methods of forming semiconductor device packages comprising stacking multiple dice, the die stack exhibiting thin bond lines and having an outer environmental coating, the bond lines and environmental coating comprising an in situ formed compound. Semiconductor device packages so formed and electronic systems incorporating such packages are also disclosed.
Status:
Grant
Type:
Utility
Filling date:
7 May 2020
Issue date:
27 Sep 2022