Micron Technology, Inc.
Semiconductor device including two or more chips mounted over wiring substrate

Abstract:

A semiconductor device includes a composite chip mounted over a wiring substrate, the composite chip including a first area, a second area that is provided independently from the first area, and a third area including a first material between the first and second areas. The first area includes a first circuit formed in the first area, and the second area includes a second circuit formed in the second area. The first area is spaced apart from the second area by the first material.