Micron Technology, Inc.
Memory arrays and methods used in forming a memory array

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Abstract:

A memory array comprises a vertical stack comprising alternating insulative tiers and wordline tiers. The wordline tiers comprise gate regions of individual memory cells. The gate regions individually comprise part of a wordline in individual of the wordline tiers. Channel material extends elevationally through the insulative tiers and the wordline tiers. The individual memory cells comprise a memory structure laterally between the gate region and the channel material. Individual of the wordlines comprise laterally-outer longitudinal-edge portions and a respective laterally-inner portion laterally adjacent individual of the laterally-outer longitudinal-edge portions. The individual laterally-outer longitudinal-edge portions project upwardly and downwardly relative to its laterally-adjacent laterally-inner portion. Methods are disclosed.

Status:
Grant
Type:

Utility

Filling date:

13 Jul 2020

Issue date:

6 Jul 2021