Micron Technology, Inc.
Self-aligned interconnection for integrated circuits
Last updated:
Abstract:
Methods and structures provide horizontal conductive lines of fine pitch and self-aligned contacts extending from them, where the contacts have at least one dimension with a more relaxed pitch. Buried hard mask materials permit self-alignment of the lines and contacts without a critical mask, such as for word-line electrode lines and word-line contacts in a memory device.
Status:
Grant
Type:
Utility
Filling date:
23 Aug 2018
Issue date:
29 Jun 2021