Micron Technology, Inc.
Self-aligned interconnection for integrated circuits

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Abstract:

Methods and structures provide horizontal conductive lines of fine pitch and self-aligned contacts extending from them, where the contacts have at least one dimension with a more relaxed pitch. Buried hard mask materials permit self-alignment of the lines and contacts without a critical mask, such as for word-line electrode lines and word-line contacts in a memory device.

Status:
Grant
Type:

Utility

Filling date:

23 Aug 2018

Issue date:

29 Jun 2021