Micron Technology, Inc.
Integrated circuit constructions comprising memory and methods used in the formation of integrated circuitry comprising memory

Abstract:

An integrated circuit construction comprising memory comprises two memory-cell-array regions having a peripheral-circuitry region laterally there-between in a vertical cross-section. The two memory-cell-array regions individually comprise a plurality of capacitors individually comprising a capacitor storage node electrode, a shared capacitor electrode that is shared by the plurality of capacitors, and a capacitor insulator there-between. A laterally-extending insulator structure is about lateral peripheries of the capacitor storage node electrodes and is vertically spaced from a top and a bottom of individual of the capacitor storage node electrodes in the vertical cross-section. The peripheral-circuitry region in the vertical cross-section comprises a pair of elevationally-extending walls comprising a first insulative composition. A second insulative composition different from the first insulative composition is laterally between the pair of walls. The pair of walls individually have a laterally-outer side of the first insulative composition that is directly against a lateral edge of the insulator structure that is in different ones of the two array regions. Other embodiments, including methods, are disclosed.