Micron Technology, Inc.
Three-dimensional memory array
Last updated:
Abstract:
An example three-dimensional (3-D) memory array includes a first plurality of conductive lines separated from one other by an insulation material, a second plurality of conductive lines, and a plurality of pairs of conductive pillars arranged to extend substantially perpendicular to the first plurality of conductive lines and the second plurality of conductive lines. The conductive pillars of each respective pair are coupled to a same conductive line of the second plurality of conductive lines. A storage element material is formed partially around the conductive pillars of each respective pair.
Status:
Grant
Type:
Utility
Filling date:
7 Feb 2020
Issue date:
18 May 2021