Micron Technology, Inc.
Methods and apparatuses for aligning read data in a stacked semiconductor device

Abstract:

Methods and apparatuses are provided for aligning read data in a stacked semiconductor device. An example apparatus includes a stacked semiconductor device comprising stacked first and second die. The stacked semiconductor device includes a first path having a first align (first die) and second align (second die) circuits for providing read data from the second die and a second path having a first replica align (first die) and second replica align (second die) circuits. During a timing align operation, a first control circuit sets the first align and replica align circuits to a first delay value based on a propagation delay of a clock signal through the second replica align circuit. After setting of the first delay value, a second control circuit sets the second align and replica align circuits to a second delay value based on a difference in propagation delays through the first and second replica align circuits.