Micron Technology, Inc.
Memory sub-system including an in-package sequencer to perform error correction and memory testing operations
Last updated:
Abstract:
A processing device of a sequencer component can receive data from a controller that is external to the sequencer component. The processing device of the sequencer component can perform an error correction operation on the data received from the controller that is external to the sequencer component to generate a code word associated with the data. The code word can be stored at a memory component coupled with the sequencer component.
Status:
Grant
Type:
Utility
Filling date:
6 Sep 2018
Issue date:
27 Apr 2021